| 整机信息 |
| 名称 | HP BladeSystem e-Class Server Blade Enclosure |
| 型号 | e-class |
| 品牌 | HP |
| 类型 | 刀柜 |
| 机架空间 | 3U，20个刀片插槽位。 |
| CPU信息 | Rear bay for 1 of 3 Interconnect Tray configurations for network cable management. Integrated Administrator for remote, out-of-band monitoring and management, Diagnostic Adapter (for connecting keyboard, video, mouse and other devices locally to individual server blades) |
| CPU类型 | 无 |
| CPU插槽数 | 无插槽。 |
| CPU激活 | |
| 刀片托架 | |
| 最大硬盘数量 | |
| 硬盘信息 | |
| 内存插槽数量 | |
| 支持内存容量范围 | |
| 内存是否需要激活 | |
| 电源描述 | Dual (1+1 redundant) hot- plug power supplies (600 watts each), Fan cage with four (2+2 redundant) hot- plug fans. |
| 介质托架 | |
| 适配器插槽 | |
| 端口 | Out-of-band local console and remote network access to the server blade enclosure and all 20 server blades via (one) RJ-45 10/100T Fast Ethernet and (one) RS-232 management connectors. Provides local and remote access to the interconnect switch command console and browser-based management interfaces. SNMP, Web (via HTTPS) and command-line interfaces (via Console connector, Telnet and Secure Shell). Remotely power on/off/reboot server blades and enclosures. Remotely toggle on/off unit identification LEDs (UID) of server blades and enclosures. Monitors and controls the enclosure fans, temperature sensors, power supplies, interconnect switch and server blade status. Connect to each server blade’s serial text console (Microsoft .NET Server and Linux). User administration for up to 25 users. Server blade bay privileges can be set on a per-user basis. Virtual NMI button generates non-maskable interrupt for crash debug and analysis. More than 100 scriptable commands enable automated management. Enables full control over server blade's Power-On Self Test (POST) and boot process, including the ROM-Based Setup Utility (RBSU). Selective enabling of all protocols, such as Telnet. Logging of operating system console, server blade and enclosure hardware events, user actions and invalid login attempts. Emergency server blade enclosure shutdown caused by a critical temperature. Enclosure Link (2) connectors reserved for future use |
| 发布日期 | |
| 下架日期 | |
| 服务截止日期 | |
| 产品尺寸 | 5.25 inch Height (3U), 17.5 inch Width, 28.35 inch Depth |
| 产品重量 | 满配 41.73 千克。 |
| 操作系统 | 无 |
| 适用刀柜 | |
| 适用刀片服务器 | HP ProLiant BL10e G2 Server series |
| 配件信息 |
| FC号 | PN号 | 品牌 | 描述 |
| 内存 |
| 128276-B21 | HP | 64MB, 133MHz, registered ECC SDRAM DIMM memory module option |
| 128277-B21 | HP | 128MB, 133MHz, ECC SDRAM DIMM memory module (Worldwide) |
| 128278-B21 | HP | 256MB, 133MHz ECC SDRAM buffered DIMM |
| 136150-B21 | HP | 64MB, 168pin, 133MHz, registered ECC SDRAM DIMM memory module(Z64) |
| 136152-B21 | HP | 128MB, 168pin, 133MHz, Registered ECC SDRAM DIMM memory module |
| 136154-B21 | HP | 64MB, 168pin, 133MHz, registered ECC SDRAM DIMM memory module (Z192) |
| 136155-B21 | HP | 256MB, 168pin, 133MHz, registered ECC SDRAM DIMM memory module (Z256) |
| 136156-B21 | HP | 128MB, 168pin, 133MHz, registered ECC SDRAM DIMM memory module(Z256) |
| 136157-B21 | HP | 256MB, 168pin, 133MHz, registered ECC SDRAM DIMM memory module(Z384) |
| 136158-B21 | HP | 128MB, 168pin, 133MHz, registered ECC SDRAM DIMM memory module(Z384) |
| 136159-B21 | HP | 256MB, 168pin, 133MHz, registered ECC SDRAM DIMM memory module(Z512) |
| 159225-001 | HP | 64MB, 133MHz ECC SDRAM buffered DIMM |
| 159226-001 | HP | 128MB, 133MHz, buffered ECC SDRAM DIMM memory module |
| 159304-001 | HP | 256MB, 133MHz ECC SDRAM buffered DIMM |
| 159377-001 | HP | 256MB, 133MHz ECC SDRAM buffered DIMM |
| 164278-001 | HP | 128MB, 133MHz ECC SDRAM buffered DIMM |
| 177628-001 | HP | 512MB PC133, 133MHz ECC SDRAM DIMM memory module (168-pin) |
| 201692-B21 | HP | 256MB memory module kit - Includes two 128MB, 133MHz ECC SDRAM buffered DIMMs (Worldwide) |
| 201693-B21 | HP | 512MB memory module kit - Includes two 256MB, 133MHz ECC SDRAM buffered DIMMs (Worldwide) |
| 其它 |
| 253075-001 | HP | BL e-Class integrated administrator board |
| 253076-001 | HP | Patch panel interconnect board - RJ-45 - With tray |
| 253077-001 | HP | BL e-Class C-GbE interconnect switch tray board (4 x RJ-45) |
| 253078-001 | HP | RJ-21x4 patch panel interconnect tray |
| 253079-001 | HP | Fan, hot-plug, 60mm |
| 253080-001 | HP | Fan backplane board with cable |
| 253081-001 | HP | Center wall board with bracket - Includes power backplane board |
| 253082-001 | HP | Hot-plug power supply - 600W |
| 253083-001 | HP | Enclosure status board |
| 253084-001 | HP | Hardware kit, Miscellaneous: Rack mount thumbscrew, Screw (panel board), Null-modem cable, Screw (enclosure status), Retractable thumbscrew |
| 253085-001 | HP | Plastics kit, Miscellaneous: Air baffle for fan cage, Plastic stand off, Bezel latch, Hood latch for top cover, Front bezel |
| 253086-001 | HP | Fan cage |
| 253087-001 | HP | System I/O board with PIII 700MHz processor |
| 253088-001 | HP | Blade blank kit - Includes five-blank and one-bay blank |
| 253089-001 | HP | Diagnostics Adapter |
| 253090-001 | HP | Return kit - Includes box and cushions for the enclosure |
| 254237-001 | HP | Maintenance and Service Guide |
| 258319-001 | HP | Localization kit (country kit) |
| 259490-001 | HP | Return kit, pack box and cushions for a single server blade |
| 270463-001 | HP | Rack-mounting hardware kit |
| 270464-001 | HP | Telco rack startup kit |
| 319603-001 | HP | Battery for real-time clock (RTC) - 3.0V, 220mAh, lithium disc cell, 20mm diameter, 3.2mm height (CR2032) |
| 硬盘 |
| 258317-001 | HP | 30GB ATA 100 hard drive - 4,200rpm hard drive assembly |
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